Disclaimer:

Some parts of this website are currently undergoing development, but exciting updates are on the way. Stay tuned for an exhilarating experience that will keep you captivated! Fair winds and following seas, The DST.news Team.
1 2 3 … 22
Home > All news > Shipping > India and USA signs MoU on semiconductorSupply Chain and Innovation Partnership

India and USA signs MoU on semiconductorSupply Chain and Innovation Partnership

March 14, 2023
Reading Time: < 1 minute
NEW DELHI : A Memorandum of Understanding (MoU) on establishing semiconductor supply chain and innovation partnership under the framework of India – US Commercial Dialogue was signed between the two countries following the Commercial Dialogue 2023 held in New Delhi.
On the invitation of Shri Piyush Goyal, Union Minister of Commerce and Industry, the US Secretary of Commerce, Ms Gina Raimondo is on a visit to New Delhi. During this visit, the India-US Commercial Dialogue was re-launched recently to discuss cooperation for unlocking new trade and investment opportunities between the two countries.
The MoU seeks to establish a collaborative mechanism between the two Governments on Semiconductor Supply chain resiliency and diversification in view of US’s CHIPS and Science Act and India’s Semiconductor Mission. 
It aims to leverage complementary strengths of both countries and facilitate commercial opportunities and development of semiconductor innovation ecosystems through discussions on various aspects of semiconductor value chain. The MoU envisages mutually beneficial R&D, talent and skill development.
FOLLOW US ON SOCIAL MEDIA
Today's News
Follow us
facebook | DST NewsTwitter | DST NEWSlinkedin | DST NEWSInstagram | DST NEWSYouTube | DST NEWS
© DAILY SHIPPING TIMES
Back
Home
crosschevron-down

You cannot copy content of this page

linkedin facebook pinterest youtube rss twitter instagram facebook-blank rss-blank linkedin-blank pinterest youtube twitter instagram